Thermal interface for multi-chip packages
US8891235B2 · kind B2 · utility
10Cited by
10References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2012 |
| Grant date | Nov 18, 2014 |
| Priority date | — |
| Expiry date | Feb 26, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermal interface unit includes a pedestal, a first contact surface below the pedestal to interface with a first die and a flat spring to enable the first contact surface to adapt to a variable height of a first die of a multi-chip package (MCP).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.