System-in-package using embedded-die coreless substrates, and processes of forming same
US8891246B2 · kind B2 · utility
9Cited by
3References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2010 |
| Grant date | Nov 18, 2014 |
| Priority date | — |
| Expiry date | Oct 28, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus includes a coreless substrate with an embedded die that is integral to the coreless substrate, and at least one device assembled on a surface that is opposite to a ball-grid array disposed on the coreless substrate. The apparatus may include an over-mold layer to protect the at least one device assembled on the surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.