Substrate processing apparatus and substrate processing method
US8894775B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 11, 2008 |
| Grant date | Nov 25, 2014 |
| Priority date | — |
| Expiry date | Jun 2, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67051
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
After a substrate is cleaned, a liquid layer of a rinse liquid is formed so as to cover one surface of the substrate. Then, a liquid supply nozzle moves outward from above the center of the substrate. The liquid supply nozzle is stopped once at the time point where it moves by a predetermined distance from above the center of the substrate. In this time period, the liquid layer is divided within a thin layer region by a centrifugal force, so that a drying core is formed at the center of the liquid layer. Thereafter, the liquid supply nozzle moves outward again, so that a drying region where no rinse liquid exists expands on the substrate with the drying core as its starting point.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.