Substrate containing aperture and methods of forming the same
US8894868B2 · kind B2 · utility
6Cited by
10References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 6, 2011 |
| Grant date | Nov 25, 2014 |
| Priority date | — |
| Expiry date | Nov 21, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24273
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of forming an aperture (e.g., a through via, a blind via, a trench, an alignment feature, etc.) within a substrate includes irradiating a substrate with a laser beam to form a laser-machined feature having a sidewall. The laser-machined feature is then processed to change at least one characteristic (e.g., the sidewall surface roughness, diameter, taper, aspect ratio, cross-sectional profile, etc.) of the laser-machined feature. The laser-machined feature can be processed to form the aperture by performing an isotropic wet-etch process employing an etchant solution containing HNO3, HF and, optionally acetic acid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.