Andy E. Hooper
12Patents
4h-index
21Co-inventors
60Inventor score
Filing activity: Aug 15, 2002 → Jan 21, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9070656B2 | Underfill-accommodating heat spreaders and related semiconductor device assemblies and methods | Electricity | 16 | Active |
| US7132372B2 | Method for preparing a semiconductor substrate surface for semiconductor device fabrication | Emerging Cross-Sectional Technologies | 7 | Expired |
| US8894868B2 | Substrate containing aperture and methods of forming the same | Emerging Cross-Sectional Technologies | 6 | Active |
| US7432024B2 | Lithographic template and method of formation and use | Physics | 6 | Active |
| US10340173B2 | System for handling semiconductor dies | Electricity | 2 | Active |
| US7083880B2 | Lithographic template and method of formation and use | Physics | 2 | Expired |
| US10079169B1 | Backside stealth dicing through tape followed by front side laser ablation dicing process | Electricity | 2 | Active |
| US7977213B1 | Use of laser energy transparent stop layer to achieve minimal debris generation in laser scribing a multilayer patterned workpiece | Performing Operations; Transporting | 1 | Active |
| US11562922B2 | Semiconductor device release during pick and place operations, and associated systems and methods | Electricity | 0 | Active |
| US10373857B2 | Backside stealth dicing through tape followed by front side laser ablation dicing process | Electricity | 0 | Active |
| US8178906B2 | Laser chalcogenide phase change device | Electricity | 0 | Active |
| US11232970B2 | Semiconductor device release during pick and place operations, and associated systems and methods | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.