Thin-film encapsulation, optoelectronic semiconductor body comprising a thin-film encapsulation and method for producing a thin-film encapsulation

US8896019B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Franz Eberhard · Kilchberg, CH
• Sebastian Taeger · Bad Abbach, DE
• Korbinian Perzlmaier · Regensburg, DE

Key dates

• Filing date: Aug 16, 2011
• Grant date: Nov 25, 2014
• Expiry date: Jan 11, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/841

Abstract

A thin-film encapsulation for an optoelectronic semiconductor body includes a PVD layer deposited by a PVD method, and a CVD layer deposited by a CVD method, wherein the CVD layer is applied directly on the PVD layer, and the CVD layer is etched back such that the CVD layer only fills weak points in the PVD layer.