Encapsulation film, package structure utilizing the same, and method for forming the package structure
US8896135B2 · kind B2 · utility
3Cited by
5References
5Claims
0Family size
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Key dates
| Filing date | Jan 4, 2011 |
| Grant date | Nov 25, 2014 |
| Priority date | — |
| Expiry date | Jan 16, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed is an encapsulation film. An inorganic oxide film is formed on an organic sealing layer by an atomic layer deposition (ALD) to form the encapsulation film, wherein the organic sealing layer is a polymer containing hydrophilic groups. The organic sealing layer and the inorganic oxide layer have covalent bondings therebetween. The encapsulation film can solve the moisture absorption problem of conventional organic sealing layers, thereby being suitable for use as a package of optoelectronic devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.