2D coil and a method of obtaining EC response of 3D coils using the 2D coil configuration
US8896300B2 · kind B2 · utility
0Cited by
3References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 8, 2010 |
| Grant date | Nov 25, 2014 |
| Priority date | — |
| Expiry date | Mar 5, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N27/9006
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention herein disclosed provides a 2D coil and a method of using the 2D wound EC sensor for reproducing the Eddy Current Testing (ECT) response of a prior art 3D orthogonal sensor. The 3D orthogonal sensor is conventionally wound onto a 3D core, with at least some of the surfaces being un-parallel to the surface be inspected. Using the herein disclosed 2D configuration allows the use of printed circuit board technologies for the manufacturing of these EC sensors. The herein disclosed method and the associated 2D EC sensors are particularly useful for reproducing the EC effect of conventional orthogonal probe arrays.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.