Electronic device and heat dissipation module thereof
US8897012B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Dec 14, 2012 |
| Grant date | Nov 25, 2014 |
| Priority date | — |
| Expiry date | Jul 17, 2033 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28D15/0275
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The disclosure provides an electronic device and a heat dissipation module having an imaginary structural plane. The heat dissipation module includes a fin assembly, a connecting part and a heat pipe. The fin assembly is disposed on the structural plane and includes a plurality of fin elements extending along a first direction. The connecting part is connected to the fin elements. The fin elements are connected to each other via the connecting part. At least one portion of the connecting part is connected to at least one portion of the heat pipe, and the connecting part and the heat pipe both extend along a second direction. The fin assembly and the connecting part are integrated and formed into one piece by die casting. The first direction and the second direction form a first included angle greater than 0 degree.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.