Method for forming circular patterns on a surface
US8900778B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 16, 2013 |
| Grant date | Dec 2, 2014 |
| Priority date | — |
| Expiry date | Dec 16, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/143
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A method for forming patterns on a surface using charged particle beam lithography is disclosed, in which a stencil is provided comprising first and second apertures, where circular or nearly-circular patterns in a first plurality of sizes are formed on the surface using the first aperture by varying shot dosage, and where circular or nearly-circular patterns in a second plurality of sizes are formed on the surface using the second aperture by varying shot dosage. A similar method for fracturing or mask data preparation is also disclosed. A stencil for charged particle beam lithography is also disclosed, where the stencil comprises first aperture and second apertures capable of forming, in one shot, patterns in a first and a second range of sizes on a surface by varying the shot dosage, where the first range of sizes is discontinuous with the second range of sizes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.