MEMS device and method of forming the same
US8900905B1 · kind B1 · utility
20Cited by
1References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 2, 2013 |
| Grant date | Dec 2, 2014 |
| Priority date | — |
| Expiry date | Aug 2, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R31/00
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for forming a MEMS device is provided. The method includes the following operations of providing a substrate having a first portion and a second portion; fabricating a membrane type sensor on the first portion of the substrate using a double-side process; and fabricating a bulk silicon sensor on the second portion of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.