Slurry composition and method of fabricating damascene structure using the same
US8901001B2 · kind B2 · utility
1Cited by
7References
23Claims
0Family size
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Key dates
| Filing date | Aug 25, 2009 |
| Grant date | Dec 2, 2014 |
| Priority date | — |
| Expiry date | Dec 28, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31053
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A slurry composition has an amount of 100% and includes abrasives, an acid-base pH adjustor, an oxidant and water. A content of the abrasives is 10 wt % to 40 wt %, and a polydisperse index of the abrasives sizes is greater than 1.8. A content of the acid-base pH adjustor is 0.01 wt % to 10 wt %. A content of the oxidant is 0.01 wt % to 10 wt %. A remaining portion of the slurry composition is water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.