Optoelectronic component and method for producing it
US8901592B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2011 |
| Grant date | Dec 2, 2014 |
| Priority date | — |
| Expiry date | Oct 24, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/853
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An optoelectronic component includes a carrier having a first connection region and a second connection region, a radiation-emitting semiconductor chip having a base surface and a radiation exit surface opposite the base surface, wherein the semiconductor chip is arranged by the base surface on the carrier, a housing having a lower housing part arranged on the carrier and adjoining side flanks of the semiconductor chip, and an upper housing part arranged on the lower housing part and shaped as a reflector for radiation emitted by the semiconductor chip, and an electrical connection layer which leads from the radiation exit surface of the semiconductor chip via a part of the interface between the lower and the upper housing part and through the lower housing part to the first connection region on the carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.