Package on package structure and method of manufacturing the same
US8901726B2 · kind B2 · utility
11Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2012 |
| Grant date | Dec 2, 2014 |
| Priority date | — |
| Expiry date | Dec 7, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package on package structure includes a first substrate having a first region and a second region, a bump formed on the first region of the first substrate, a first semiconductor die bonded to the second region of the first substrate, and a semiconductor die package bonded to the first substrate. The bump includes a metallic structure and a plurality of minor elements dispersed in the metallic structure. The semiconductor die package includes a connector bonded to the bump, and the first semiconductor die is between the semiconductor die package and the first substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.