Integrated circuit arrangement with an auxiliary indentation, particularly with aligning marks

US8901737B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• Klaus Goller · Dresden, DE
• Olaf Heitzsch · Coswig, DE
• Marion Nichterwitz · Dresden, DE

Key dates

• Filing date: Aug 11, 2010
• Grant date: Dec 2, 2014
• Expiry date: Aug 23, 2030

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

An integrated circuit arrangement is disclosed having a wiring indentation and an auxiliary indentation in a dielectric layer. The wiring indentation contains a metal through which current flows during operation of the circuit arrangement. The auxiliary indentation contains a metal through which an electric current does not flow during operation of the circuit arrangement. The auxiliary indentation serves as an alignment mark during the production of the integrated circuit arrangement.