Semiconductor packages and electronic systems including the same
US8901749B2 · kind B2 · utility
27Cited by
13References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2014 |
| Grant date | Dec 2, 2014 |
| Priority date | — |
| Expiry date | Feb 3, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A plurality of semiconductor chips may be stacked on the substrate, and each of them may include at least one electrode pad. At least one of the plurality of semiconductor chips may include at least one redistribution pad configured to electrically connect with the at least one electrode pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.