Electronic component termination and assembly by means of transient liquid phase sintering and polymer solder pastes

US8902565B2 · kind B2 · utility

Assignee

• KEMET Electronics Corporation · US

Inventors

• John E. McConnell · Ann Arbor, US
• John Bultitude · Greenville, US
• Reggie Phillips · Simpsonville, US
• Robert Allen Hill · Simpsonville, US
• Garry L. Renner · Simpsonville, US
• Philip M. Lessner · Newberry, US
• Antony P. Chacko · Simpsonville, US
• Jeffrey W. Bell · Simpsonville, US
• Keith Brown · Walford, US

Key dates

• Filing date: May 24, 2011
• Grant date: Dec 2, 2014
• Expiry date: Jun 15, 2032

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/435
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A capacitor has first planer internal electrodes in electrical contact with a first external termination. Second planer internal electrodes are interleaved with the first planer internal electrodes wherein the second planer internal electrodes are in electrical contact with a second external termination. A dielectric is between the first planer internal electrodes and the second planer internal electrodes and at least one of the external terminations comprises a material selected from a polymer solder and a transient liquid phase sintering adhesive.