Temperature controlled loadlock chamber
US8905124B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2007 |
| Grant date | Dec 9, 2014 |
| Priority date | — |
| Expiry date | Dec 3, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67248
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A temperature controlled loadlock chamber for use in semiconductor processing is provided. The temperature controlled loadlock chamber may include one or more of an adjustable fluid pump, mass flow controller, one or more temperature sensors, and a controller. The adjustable fluid pump provides fluid having a predetermined temperature to a temperature-controlled plate. The mass flow controller provides gas flow into the chamber that may also aid in maintaining a desired temperature. Additionally, one or more temperature sensors may be combined with the adjustable fluid pump and/or the mass flow controller to provide feedback and to provide a greater control over the temperature. A controller may be added to control the adjustable fluid pump and the mass flow controller based upon temperature readings from the one or more temperature sensors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.