Interposer configuration with thermally isolated regions for temperature-sensitive opto-electronic components
US8905632B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 28, 2012 |
| Grant date | Dec 9, 2014 |
| Priority date | — |
| Expiry date | Jan 22, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/0064
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An interposer (support substrate) for an opto-electronic assembly is formed to include a thermally-isolated region where temperature-sensitive devices (such as, for example, laser diodes) may be positioned and operate independent of temperature fluctuations in other areas of the assembly. The thermal isolation is achieved by forming a boundary of dielectric material through the thickness of the interposer, the periphery of the dielectric defining the boundary between the thermally isolated region and the remainder of the assembly. A thermo-electric cooler can be used in conjunction with the temperature-sensitive device(s) to stabilize the operation of these devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.