Room temperature bonding apparatus
US8906175B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2009 |
| Grant date | Dec 9, 2014 |
| Priority date | — |
| Expiry date | Oct 26, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/17
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A room temperature bonding apparatus according to the present invention is provided with a load lock chamber having an internal space which is pressure-reduced; and a cartridge arranged in the load lock chamber. The cartridge includes an island portion formed to contact a substrate when the substrate is put on the cartridge. A flow passage is formed for the island portion to connect a space between the cartridge and the substrate to outside when the substrate is put on the cartridge. Therefore, in the room temperature bonding apparatus can prevent making the substrate is moved to the cartridge due to gas when the internal space is pressure-reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.