Sputtering apparatus, sputtering method, and electronic device manufacturing method
US8906208B2 · kind B2 · utility
2Cited by
2References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 10, 2011 |
| Grant date | Dec 9, 2014 |
| Priority date | — |
| Expiry date | Sep 23, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N50/01
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A sputtering apparatus includes a substrate holder which holds a substrate to be rotatable in the plane direction of the processing surface of the substrate, a substrate-side magnet which is arranged around the substrate and forms a magnetic field on the processing surface of the substrate, a cathode which is arranged diagonally above the substrate and receives discharge power, a position detection unit which detects the rotational position of the substrate, and a controller which controls the discharge power in accordance with the rotational position detected by the position detection unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.