Circuit structure of electronic device and its manufacturing method
US8907228B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2012 |
| Grant date | Dec 9, 2014 |
| Priority date | — |
| Expiry date | Sep 19, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure related to circuit structure of an electronic device, wherein the circuit structure comprises of a main line formed on a substrate; and at least an auxiliary line electrically connected to the main line to form a conductive return circuit used for a signal to pass through the auxiliary line when the main line is disconnected. Addition of the auxiliary line avoids any breaking of signal transmission due to partial disconnection of the main line. The present disclosure also relates to a method for manufacturing the circuit structure, wherein the method simplifies the manufacturing process and also reduces the rate of deformation or disconnection of lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.