MEMS inertial sensor and method for manufacturing the same

US8907434B2 · kind B2 · utility

Assignee

• LEXVU OPTO MICROELECTRONICS TECHNOLOGY (SHANGHAI) LTD · CN

Inventors

• Zhiwei Wang · Beijing, CN
• Deming Tang · Shanghai, CN
• Lei Zhang · Nanhu, CN
• Jianhong Mao · Shanghai, CN
• Fengqin Han · Shanghai, CN

Key dates

• Filing date: Apr 25, 2013
• Grant date: Dec 9, 2014
• Expiry date: Jun 14, 2033

Classification

• Technology area (CPC G): Physics
• CPC primary: G01P15/125
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A MEMS inertial sensor and a method for manufacturing the same are provided. The method includes: depositing a first carbon layer on a semiconductor substrate; patterning the first carbon layer to form a fixed anchor bolt, an inertial anchor bolt and a bottom sealing ring; forming a contact plug in the fixed anchor bolt and a contact plug in the inertial anchor bolt; forming a first fixed electrode, an inertial electrode and a connection electrode on the first carbon layer, where the first fixed electrode and the inertial electrode constitute a capacitor; forming a second carbon layer on the first fixed electrode and the inertial electrode; and forming a sealing cap layer on the second carbon layer and the top sealing ring. Under an inertial force, only the inertial electrode may move, the fixed electrode will almost not move or vibrate, which improves the accuracy of the MEMS inertial sensor.