Inventor · Shanghai, CN

Fengqin Han

8Patents
2h-index
6Co-inventors
36Inventor score

Filing activity: Jan 26, 2011 → May 27, 2015

Most-cited inventions

PatentTitleAreaCited byStatus
US9570429B2 Methods of fabrication and testing of three-dimensional stacked integrated circuit system-in-package Electricity 5 Active
US8945967B2 Photosensitive imaging device and method for forming semiconductor device Electricity 5 Active
US9112008B2 MEMS device and method of forming the same Electricity 0 Active
US9933356B2 Apparatus and method for detecting and analyzing macromolecules in biological fluid Physics 0 Active
US8907434B2 MEMS inertial sensor and method for manufacturing the same Physics 0 Active
US9491340B2 Micro-electro-mechanical system based device for adjusting aperture and manufacturing method thereof Physics 0 Active
US8773748B2 Light modulator pixel unit and manufacturing method thereof Emerging Cross-Sectional Technologies 0 Active
US9145293B2 Micro-electro-mechanical system based focusing device and manufacturing method thereof Physics 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.