Patent · US Active

Window interposed die packaging

US8907471B2 · kind B2 · utility

36Cited by

5References

20Claims

0Family size

Assignee

IMEC · BE

Inventors

Eric Beyne · Heverlee, BE
Paresh Limaye · Heverlee, BE

Key dates

Filing date	Dec 23, 2010
Grant date	Dec 9, 2014
Priority date	—
Expiry date	Dec 23, 2030

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/351
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor device is described advantageously making use of the interposer principle. The semiconductor device comprises at least one semiconductor die, a window substrate being an inorganic substrate comprising at least one window-shaped cavity for mounting the at least one semiconductor die, the window substrate having interconnect structures. Furthermore, the at least one semiconductor die is positioned inside the at least one cavity and is connected to the interconnect structures, providing connections to another level of assembly or packaging of the semiconductor device. The invention also relates to a method of manufacturing such a semiconductor device.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.