Integrated circuit package including wire bond and electrically conductive adhesive electrical connections
US8907482B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 8, 2012 |
| Grant date | Dec 9, 2014 |
| Priority date | — |
| Expiry date | Nov 8, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1659
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system may include a package defining a cavity and an integrated circuit (IC) disposed within the cavity. The package may include a first electrically conductive package contact and a second electrically conductive package contact. The IC may include a first electrically conductive IC contact and a second electrically conductive IC contact. The system also may include a wire bond extending between and electrically connecting the first electrically conductive package contact and the first electrically conductive IC contact. The system further may include an electrically conductive adhesive extending between and electrically connecting the second electrically conductive package contact and the second electrically conductive IC contact. Use of wire bonds and electrically conductive adhesive may increase an interconnect density between the IC and the package, while not requiring an increase in size of the IC or a decrease in pitch between wire bonds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.