Proactive cooling of chips using workload information and controls

US8909383B2 · kind B2 · utility

Assignee

• International Business Machines Corporation · US

Inventors

• Scott J. Hadderman · Pleasant Valley, US
• Daniel J. Kearney · Ulster Park, US
• Wei Huang · Austin, US
• K. Paul Muller · Wappingers Falls, US
• William J. Rooney · Hopewell Junction, US
• Guillermo J. Silva · Austin, US
• Malcolm S. Ware · Raleigh, US
• Emmanuel Yashchin · Yorktown Heights, US
• Peter B. Yocom · Lagrangeville, US

Key dates

• Filing date: Dec 22, 2011
• Grant date: Dec 9, 2014
• Expiry date: Mar 7, 2033

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02D10/00
• WIPO field: Control
• WIPO sector: Instruments

Abstract

A method to reduce large temperature over/undershoot in a computer system. Using workload data, the method proactively modifies controls of mechanical cooling system to anticipate power and take appropriate actions to maintain temperature. Workload control modifies workload and scheduling to reduce power transients and subsequent temperature deviations. In addition, workload control allows more even distribution of temp across chips, allowing for even wear and reduction of small/ripple/noise temp oscillations. A system and program product for carrying out the method are also provided.