Method of forming pattern using actinic-ray or radiation-sensitive resin composition, and pattern
US8911930B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 3, 2010 |
| Grant date | Dec 16, 2014 |
| Priority date | — |
| Expiry date | Jun 3, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/325
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
According to one embodiment, a method of forming a pattern includes the step of applying an actinic-ray- or radiation-sensitive resin composition on a substrate so as to form a film, the step of selectively exposing the film through a mask and the step of developing the exposed film with the use of a developer containing an organic solvent, wherein the actinic-ray- or radiation-sensitive resin composition contains a resin (A) whose polarity is increased by the action of an acid so that the solubility of the resin in the developer containing an organic solvent is decreased, a photoacid generator (B) that when exposed to actinic rays or radiation, generates an acid containing a fluorine atom and a solvent (C), and wherein the photoacid generator (B) is contained in the composition in a ratio of 8 to 20 mass % based on the total solids of the composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.