Electronic device cooling with microjet impingement and method of assembly

US8912643B2 · kind B2 · utility

Assignee

• General Electric Company · US

Inventors

• Hendrik Pieter Jacobus de Bock · Clifton Park, US
• Stanton Earl Weaver · Broadalbin, US
• Raj Bahadur · Gilbert, US
• Eric A. Browne · Westford, US
• Gary Dwayne Mandrusiak · Latham, US

Key dates

• Filing date: Dec 10, 2012
• Grant date: Dec 16, 2014
• Expiry date: Feb 15, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An integrated circuit device including a die with a substrate with a first surface and a second surface opposite the first surface is provided. The die includes at least one circuit element positioned on the first surface. Formed on the second surface, is a wetting feature that includes an array of spaced-apart nanoscale structures and/or an array of spaced-apart microscale structures. The wetting feature also includes a wettability coating applied to at least a portion of the second surface. The integrated circuit device includes a spacer coupled to the die adjacent to the second surface. In addition, an injector plate is coupled to the spacer. The injector plate includes at least one microjet and at least one exit hole defined through the injector plate. The at least one exit hole is positioned adjacent to the at least one microjet.