Eric A. Browne
10Patents
8h-index
11Co-inventors
65Inventor score
Filing activity: Dec 10, 2012 → Nov 10, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8912643B2 | Electronic device cooling with microjet impingement and method of assembly | Electricity | 23 | Active |
| US10651112B2 | Thermal management of RF devices using embedded microjet arrays | Emerging Cross-Sectional Technologies | 17 | Active |
| US10512152B2 | Device array backframe with integral manifolding for high performance fluid cooling | Electricity | 16 | Active |
| US10665529B2 | Modular microjet cooling of packaged electronic components | Electricity | 16 | Active |
| US10903141B2 | Thermal management of RF devices using embedded microjet arrays | Emerging Cross-Sectional Technologies | 15 | Active |
| US11018077B2 | Modular microjet cooling of packaged electronic components | Electricity | 11 | Active |
| US11322426B2 | Thermal management of RF devices using embedded microjet arrays | Emerging Cross-Sectional Technologies | 10 | Active |
| US11594470B2 | Modular microjet cooling of packaged electronic components | Electricity | 9 | Active |
| US9777966B2 | System for cooling heat generating electrically active components for subsea applications | Electricity | 2 | Active |
| US12289861B2 | Liquid-in-liquid cooling system for electronic components | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.