Method for producing a plurality of optoelectronic semiconductor chips

US8916403B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Ewald Karl Michael Günther · Regenstauf, DE
• Mathias Kämpf · Burglengenfeld, DE
• Jens Dennemarck · Regensburg, DE
• Nikolaus Gmeinwieser · Donaustauf, DE

Key dates

• Filing date: Feb 3, 2011
• Grant date: Dec 23, 2014
• Expiry date: May 24, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/78
• WIPO field: Other special machines
• WIPO sector: Mechanical engineering

Abstract

A method for producing a plurality of optoelectronic semiconductor chips includes providing a carrier wafer having a first surface and a second surface opposite the first surface, wherein a plurality of individual component layer sequences spaced apart from one another in a lateral direction are applied on the first surface, the component layer sequences being separated from one another by separation trenches; introducing at least one crystal imperfection in at least one region of the carrier wafer which at least partly overlaps a separation trench in a vertical direction; singulating the carrier wafer along the at least one crystal imperfection into individual semiconductor chips.