Lid attach process and apparatus for fabrication of semiconductor packages
US8916419B2 · kind B2 · utility
10Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2012 |
| Grant date | Dec 23, 2014 |
| Priority date | — |
| Expiry date | Oct 19, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package assembly process that includes attaching one or more dies to a substrate; applying an adhesive material on a periphery of the substrate by an adhesive dispenser having a stamp-type dispensing head; applying a thermal interface material (TIM) on a top surface of the die by a TIM dispenser having a stamp-type dispensing head; and positioning a lid over the one or more dies and placing the lid on top of the adhesive material and the TIM by a lid carrier to encapsulate the one or more dies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.