Patent · US Active

Device for aligning and pre-fixing a wafer

US8918989B2 · kind B2 · utility

3Cited by

5References

8Claims

0Family size

Assignee

EV Group GmbH · AT

Inventors

Jurgen Burggraf · Ried im Innkreis, AT
Friedrich Paul Lindner · Ried im Innkreis, AT
Stefan Pargfrieder · Reichenau, AT
Daniel Burgstaller · Ried im Innkreis, AT

Key dates

Filing date	Mar 31, 2010
Grant date	Dec 30, 2014
Priority date	—
Expiry date	Mar 12, 2031

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/53978
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A device for aligning and prefixing a flat substrate on a carrier substrate for the further processing of the substrate. The device includes aligning means for aligning a substrate's outside contour relative to a carrier substrate's outside contour by engaging the substrate's outside contour. The alignment of the substrate is carried out along a substrate plane E that is parallel to a contact surface of the substrate. Attaching means is provided for at least partial prefixing of the aligned substrate on the carrier substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.