EV Group GmbH
29Patents
29Active
29Granted
47Portfolio score
Filing activity: Mar 13, 2009 → Apr 17, 2018 · 8 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9381732B2 | Device for stripping a product substrate from a carrier substrate | Emerging Cross-Sectional Technologies | 8 | Active |
| US8443864B2 | Device for stripping a wafer from a carrier | Emerging Cross-Sectional Technologies | 6 | Active |
| US9061388B2 | System having two oscillation components for machining a workpiece | Emerging Cross-Sectional Technologies | 5 | Active |
| US9555479B2 | Chuck adapted for automated coupling | Emerging Cross-Sectional Technologies | 3 | Active |
| US8449716B2 | Device and method for separating a substrate from a carrier substrate | Emerging Cross-Sectional Technologies | 3 | Active |
| US8918989B2 | Device for aligning and pre-fixing a wafer | Emerging Cross-Sectional Technologies | 3 | Active |
| US9278433B2 | Receiving device for receiving semiconductor substrates | Electricity | 2 | Active |
| US8894807B2 | Device and method for detaching a semiconductor wafer from a substrate | Emerging Cross-Sectional Technologies | 1 | Active |
| US9738042B2 | Die tool, device and method for producing a lens wafer | Physics | 1 | Active |
| US9052422B2 | Method and device for producing a microlens | Physics | 1 | Active |
| US9138978B2 | Device for separating a substrate from a carrier substrate | Emerging Cross-Sectional Technologies | 1 | Active |
| US9272501B2 | Device for detaching a product substrate off a carrier substrate | Emerging Cross-Sectional Technologies | 1 | Active |
| US8597980B2 | Method for bonding of chips on wafers | Electricity | 1 | Active |
| US8714611B2 | Handling device for handling of a wafer | Electricity | 1 | Active |
| US9662846B2 | Method and device for producing a lens wafer | Performing Operations; Transporting | 1 | Active |
| US8603294B2 | Method for stripping a wafer from a carrier | Emerging Cross-Sectional Technologies | 0 | Active |
| US10279551B2 | Method for producing a microlens | Physics | 0 | Active |
| US8905111B2 | Device for releasing an interconnect layer that provides connection between a carrier and a wafer | Emerging Cross-Sectional Technologies | 0 | Active |
| US9771223B2 | Device and method for processing of wafers | Emerging Cross-Sectional Technologies | 0 | Active |
| US9381729B2 | Device for detaching a product substrate off a carrier substrate | Emerging Cross-Sectional Technologies | 0 | Active |
| US8828147B2 | Device and method for loosening a polymer layer from a surface of a substrate | Electricity | 0 | Active |
| US10668678B2 | Die tool, device and method for producing a lens wafer | Physics | 0 | Active |
| US8986496B2 | Device and method for stripping a product substrate from a carrier substrate | Emerging Cross-Sectional Technologies | 0 | Active |
| US9643366B2 | Method and device for producing a lens wafer | Performing Operations; Transporting | 0 | Active |
| US9751698B2 | Device and method for processing wafers | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.