Methods and apparatus for large diameter wafer handling
US8919563B2 · kind B2 · utility
12Cited by
18References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2013 |
| Grant date | Dec 30, 2014 |
| Priority date | — |
| Expiry date | Mar 19, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67763
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A front semiconductor opening wafer container for large diameter wafers includes a container portion and a door. The container portion includes a left closed side, a right closed side, a closed back, an open front, and an open interior including a plurality of slots for receiving and containing the wafers. The door is attachable to the container portion to close the open front and selectively latchable to the container portion. The container portion can accommodate large diameter wafers, particularly 450 mm wafers. Optimized sag control is provided as well as enhanced structural rigidity, and wafer seating features.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.