Ultrasonic laminating of materials for ink jet printheads
US8919915B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2012 |
| Grant date | Dec 30, 2014 |
| Priority date | — |
| Expiry date | Jan 31, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2002/14403
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method for assembling a printhead such as an ink jet printhead can include the use of an ultrasonic bonding process to bond two or more printhead layers together. In an embodiment, an ultrasonic frequency is directed to an interface between a first layer and a second layer to generate heat at the interface. In an embodiment, the heat melts at least one of the first layer and the second layer, and the layers are cooled to cure the melted layer. In another embodiment, the heat generated using the ultrasonic frequency cures an adhesive layer between the first layer and the second layer. The ultrasonic lamination process described can result in a fluid-tight seal which requires less processing time and materials over an adhesive-based process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.