Process for treatment of substrates with water vapor or steam
US8920577B2 · kind B2 · utility
0Cited by
33References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 1, 2010 |
| Grant date | Dec 30, 2014 |
| Priority date | — |
| Expiry date | Jul 15, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6708
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of treating a substrate comprises, in one aspect, placing a substrate having material on a surface thereof in a treatment chamber; directing a stream of a liquid treatment composition to impinge the substrate surface; and directing a stream of water vapor to impinge the substrate surface and/or to impinge the liquid treatment composition. A preferred aspect of this invention is the removal of materials, and preferably photoresist, from a substrate, wherein the treatment composition is a liquid sulfuric acid composition comprising sulfuric acid and/or its desiccating species and precursors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.