Paddle for electroplating for selectively depositing greater thickness
US8920616B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2012 |
| Grant date | Dec 30, 2014 |
| Priority date | — |
| Expiry date | Feb 6, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/123
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electroplating method is disclosed that selectively deposits a greater thickness of a metal or alloy layer on a region of wafer that has a higher thickness loss during a subsequent chemical mechanical polish process. A paddle assembly has three rectangular sides joined at their edges to form a triangle shape from an end view, and a notch in a bottom side that faces a wafer during the plating process. The notch extends along second and third paddle sides to a height up to about 50% of the paddle thickness. The thickness in a K-block region that has two sides formed parallel to the wafer flat is selectively increased by aligning a first side of the paddle notch side directly over one K-block side and aligning a second notch side directly over a second K-block side during a paddle movement cycle. The notch may be rectangular shaped or tapered.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.