Component-embedded substrate, and method of manufacturing the component-embedded substrate
US8921706B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2010 |
| Grant date | Dec 30, 2014 |
| Priority date | — |
| Expiry date | Feb 18, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A component-embedded substrate includes an electrically insulating base (11) of resin, an electric or electronic embedded component (8) and a dummy embedded component (7) both embedded in the insulating base (11), a conductor pattern (18) formed on at least one side of the insulating base (11) and connected directly to or indirectly via a connection layer (6) to the embedded component (8) and the dummy embedded component (7), and a mark (10) formed on a surface of the dummy embedded component (7) and used as a reference when the conductor pattern (18) is formed, whereby positional accuracy of the conductor pattern (18) relative to the embedded component (8) can be improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.