Chip-scale Schottky device
US8921969B2 · kind B2 · utility
0Cited by
18References
13Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 18, 2006 |
| Grant date | Dec 30, 2014 |
| Priority date | — |
| Expiry date | Sep 4, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13091
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A chip-scale schottky package which has at least one cathode electrode and at least one anode electrode disposed on only one major surface of a die, and solder bumps connected to the electrode for surface mounting of the package on a circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.