MEMS sensor with stress isolation and method of fabrication
US8925384B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 29, 2012 |
| Grant date | Jan 6, 2015 |
| Priority date | — |
| Expiry date | Oct 26, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A MEMS sensor (20, 86) includes a support structure (26) suspended above a surface (28) of a substrate (24) and connected to the substrate (24) via spring elements (30, 32, 34). A proof mass (36) is suspended above the substrate (24) and is connected to the support structure (26) via torsional elements (38). Electrodes (42, 44), spaced apart from the proof mass (36), are connected to the support structure (26) and are suspended above the substrate (24). Suspension of the electrodes (42, 44) and proof mass (36) above the surface (28) of the substrate (24) via the support structure (26) substantially physically isolates the elements from deformation of the underlying substrate (24). Additionally, connection via the spring elements (30, 32, 34) result in the MEMS sensor (22, 86) being less susceptible to movement of the support structure (26) due to this deformation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.