Microfluidic nozzle formation and process flow
US8925835B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2009 |
| Grant date | Jan 6, 2015 |
| Priority date | — |
| Expiry date | Aug 31, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T137/6416
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A method that includes forming a chamber in a substrate, forming a silicon layer overlying the chamber, etching the silicon layer to remove selected regions and retain a selected portion overlying the chamber, the selected portion being at a location and having dimensions that correspond to a location and to dimensions of a nozzle, and forming a first metal layer adjacent to the selected portion. The method also includes forming a path in the substrate to expose the chamber concurrently with removing the selected portion of the silicon layer to expose the nozzle, the nozzle being in fluid communication with the path, the chamber, and a surrounding environment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.