Method and apparatus for an optical interconnect system

US8926196B2 · kind B2 · utility

Assignee

• Intel Corporation · US

Inventors

• Abram M. Detofsky · Tigard, US
• Chukwunenye S. Nnebe · Folsom, US
• Jin Yang · Hillsboro, US
• Tak M. Mak · Union City, US
• Sasha N. Oster · Chandler, US

Key dates

• Filing date: Sep 28, 2012
• Grant date: Jan 6, 2015
• Expiry date: Jan 9, 2033

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49826
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

Provided are a method and a system, in which a first device aligns a chip to a socket along a first axis. A second device aligns the chip to the socket along a second axis, and a third device aligns the chip to the socket along a plane formed by the first axis and a third axis. Also provided is a system comprising a first optical element, and a second optical element, where a first elastic element is coupled to the first optical element, and a second elastic element is coupled to the second optical element, and where the first elastic element is aligned to the second elastic element via elastic coupling.