Method for bonding bodies and composite body

US8927090B2 · kind B2 · utility

Assignee

• Carl Zeiss SMT GmbH · DE

Inventors

• Hin Yiu Anthony Chung · Blaustein, DE
• Dirk Schaffer · Jena, DE

Key dates

• Filing date: Sep 29, 2011
• Grant date: Jan 6, 2015
• Expiry date: Nov 18, 2031

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/24777
• WIPO field: Other special machines
• WIPO sector: Mechanical engineering

Abstract

A method for bonding a first body (2) to a second, panel-shaped body (3) at bonding surfaces (2a, 3a) lying opposite each other, the second body (3) projecting in at least one direction (X) beyond an edge (2′) of the first body (2). The method includes: producing a plurality of spacers (4a to 4e, 4a′ to 4e′) on at least one of the bonding surfaces (2a), applying adhesive (5) into intermediate spaces (6a to 6d) between the spacers beyond an outer spacer (4e, 4e′) as far as an adhesive periphery (5a), which is formed at an edge (2′) of the first body (2), and bonding the bodies (2, 3) by bringing the bonding surfaces (2a, 3a) into contact at the spacers (4a′ to 4e′). A prescribed distance (d) between the adhesive periphery (5a) and the outermost spacer (4e) is set to provide a desired state of deformation of the panel-shaped body (3) after a shrinkage of the applied adhesive (5) (e.g. minimized bending of the body.) In an associated composite body (1), the prescribed distance (d) lies between 20 μm and 250 μm, preferably between 30 μm and 200 μm, in particular between 40 μm and 150 μm.