Package-on-package process for applying molding compound
US8927391B2 · kind B2 · utility
0Cited by
16References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 27, 2011 |
| Grant date | Jan 6, 2015 |
| Priority date | — |
| Expiry date | Feb 28, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of packaging includes placing a package component over a release film, wherein solder balls on a surface of the package component are in physical contact with the release film. Next, A molding compound filled between the release film and the package component is cured, wherein during the step of curing, the solder balls remain in physical contact with the release film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.