Micromechanical component and method for the manufacture of same
US8928099B2 · kind B2 · utility
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4References
9Claims
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Key dates
| Filing date | Feb 1, 2013 |
| Grant date | Jan 6, 2015 |
| Priority date | — |
| Expiry date | Feb 1, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2201/025
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A method for manufacturing a micromechanical component is described in which a trench etching process and a sacrificial layer etching process are carried out to form a mass situated movably on a substrate. The movable mass has electrically isolated and mechanically coupled subsections of a functional layer. A micromechanical component having a mass situated movably on a substrate is also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.