Patent · US Active

Micromechanical component and method for the manufacture of same

US8928099B2 · kind B2 · utility

0Cited by
4References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateFeb 1, 2013
Grant dateJan 6, 2015
Priority date
Expiry dateFeb 1, 2033

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB81B2201/025
  • WIPO fieldMicro-structural and nano-technology
  • WIPO sectorChemistry

Abstract

A method for manufacturing a micromechanical component is described in which a trench etching process and a sacrificial layer etching process are carried out to form a mass situated movably on a substrate. The movable mass has electrically isolated and mechanically coupled subsections of a functional layer. A micromechanical component having a mass situated movably on a substrate is also described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.