Adjustable wafer plating shield and method
US8932443B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 16, 2013 |
| Grant date | Jan 13, 2015 |
| Priority date | — |
| Expiry date | May 16, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A wafer carrier is described. In one embodiment, the wafer carrier includes a variable aperture shield. The wafer carrier may include an electrically conductive wafer plating jig base having a plurality of concentric overlapping cavities of different depths, each cavity configured to receive a semiconductor wafer of a different size, a plurality of concentric magnetic attractors, at least one positioned within each of the plurality of overlapping cavities, and a cover plate comprising an open center surrounded by a support, the cover plate comprising an attractive material positioned within the support adjacent to the open center and aligned with at least one of the magnetic attractors when the cover plate is positioned over the wafer plating jig base.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.