Patent assignee · US · COMPANY

DECA TECHNOLOGIES INC.

45Patents
45Active
45Granted
52Portfolio score

Filing activity: Sep 7, 2010 → Apr 22, 2019 · 1 expiring within 5 years

Most-cited patents

PatentTitleAreaCited byStatus
US9887103B2 Semiconductor device and method of adaptive patterning for panelized packaging Electricity 37 Active
US9040316B1 Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping Electricity 24 Active
US9177926B2 Semiconductor device and method comprising thickened redistribution layers Electricity 18 Active
US9831170B2 Fully molded miniaturized semiconductor module Electricity 17 Active
US8799845B2 Adaptive patterning for panelized packaging Emerging Cross-Sectional Technologies 15 Active
US8535978B2 Die up fully molded fan-out wafer level packaging Electricity 14 Active
US8656333B1 Integrated circuit package auto-routing Electricity 13 Active
US9761571B2 Thermally enhanced fully molded fan-out module Electricity 11 Active
US8604600B2 Fully molded fan-out Electricity 9 Active
US9196509B2 Semiconductor device and method of adaptive patterning for panelized packaging Electricity 9 Active
US8932443B2 Adjustable wafer plating shield and method Emerging Cross-Sectional Technologies 9 Active
US10720417B2 Thermally enhanced fully molded fan-out module Electricity 8 Active
US10050004B2 Fully molded peripheral package on package device Electricity 8 Active
US9613912B2 Method of marking a semiconductor package Electricity 7 Active
US9337086B2 Die up fully molded fan-out wafer level packaging Electricity 7 Active
US9269622B2 Semiconductor device and method of land grid array packaging with bussing lines Electricity 7 Active
US9576919B2 Semiconductor device and method comprising redistribution layers Electricity 7 Active
US9418905B2 Adaptive patterning for panelized packaging Emerging Cross-Sectional Technologies 7 Active
US8922021B2 Die up fully molded fan-out wafer level packaging Electricity 5 Active
US9520331B2 Adaptive patterning for panelized packaging Emerging Cross-Sectional Technologies 5 Active
US10373902B2 Fully molded miniaturized semiconductor module Electricity 5 Active
US8826221B2 Adaptive patterning for panelized packaging Emerging Cross-Sectional Technologies 5 Active
US9978655B2 Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping Electricity 3 Active
US8835230B2 Fully molded fan-out Electricity 3 Active
US9754835B2 Semiconductor device and method comprising redistribution layers Emerging Cross-Sectional Technologies 3 Active

Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.