Method of measuring surface properties of polishing pad
US8932883B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 11, 2013 |
| Grant date | Jan 13, 2015 |
| Priority date | — |
| Expiry date | Sep 11, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/10
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention relates to a method of measuring surface properties of a polishing pad which measures surface properties such as surface topography or surface condition of a polishing pad used for polishing a substrate such as a semiconductor wafer. The method of measuring surface properties of a polishing pad includes applying a laser beam to the polishing pad, detecting scattered light that is reflected and scattered by the polishing pad with a photodetector and performing an optical Fourier transform on the detected scattered light to produce an intensity distribution corresponding to a spatial wavelength spectrum based on surface topography of the polishing pad, and calculating a numerical value representing surface properties of the polishing pad based on the intensity distribution corresponding to two different prescribed spatial wavelength ranges.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.