Patent · US Active

Wafers and chips comprising test structures

US8933448B2 · kind B2 · utility

0Cited by

1References

24Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Markus Zundel · Egmating, DE
Uwe Schmalzbauer · Neubiberg, DE

Key dates

Filing date	Jul 27, 2012
Grant date	Jan 13, 2015
Priority date	—
Expiry date	Jul 27, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Wafers with chips thereon and corresponding chips are provided where test structures or parts thereof are provided in a peripheral chip area of the chip. Corresponding methods are also disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.